Apparatus for and method for polishing workpiece

Abrading – Abrading process – Glass or stone abrading

Reissue Patent

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C451S005000, C451S285000, C451S286000, C451S288000

Reissue Patent

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RE038854

ABSTRACT:
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

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U.S. Appl. No. 08/524,824, filed Sep. 7, 1995, Kimura et al., entitled “Method and Apparatus for Polishing Workpiece”, now U.S. Pat. No. 5,651,724.

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