Apparatus for and method for polishing workpiece

Details Apparatus for and method for polishing workpiece Apparatus for and method for polishing workpiece

1997-02-27

1998-06-09

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 5, 451285, 451286, 451287, 451288, 451289, 451388, B24B 500

Patent

active

057625395

ABSTRACT:
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.

REFERENCES:
patent: 4373991 (1983-02-01), Banks
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5670011 (1997-09-01), Togawa et al.
U.S. Pat. application Ser. No. 08/524,824, filed Sep. 7, 1995, Kimura et al., entitled "Method and Apparatus for Polishing Workpiece".

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