Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1984-11-13
1985-11-26
Dawson, Robert A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
141 1, 141114, 156349, 156578, 222213, 222215, 264 36, 404107, 425 13, 427140, B32B 3500
Patent
active
045552860
ABSTRACT:
An adhesive filler apparatus is disclosed comprising an injector and a support portion, the injector comprising a pressure buffer tube made of an elastic material and check valves adjacent both ends of the pressure buffer tube, the support portion comprising a base member and a projection. The adhesive filler apparatus disclosed is used as follows: A hose connected to a pump is coupled to one end of the pressure buffer tube so that the nozzle of the hose presses the check valve to clear its closure, allowing an adhesive to be fed in the pressure buffer tube. The hose is disconnected from the fed and swollen tube, causing the check valve to close the end of the tube. The fed injector is coupled to the support portion fixed on the crack developed in a concrete structure, etc., whereupon the projection on the support portion presses the check valve to open the end of the tube, thereby allowing the adhesive in the tube to be filled in the crack by gradual and continuous contraction of the elastic tube. Where the quantity of adhesive reserved in the tube is not enough, adhesive can be supplemented in the tube through the other end of the tube left idle so that the injector need not be detached from the crack for supplementation of adhesive in the tube.
REFERENCES:
patent: 926129 (1909-06-01), Murrie
patent: 1926415 (1933-09-01), Wertz
patent: 3255788 (1966-06-01), Cook
patent: 4132516 (1979-01-01), Story
patent: 4245970 (1981-01-01), St. Onge
patent: 4280861 (1981-07-01), Schwartz
patent: 4385015 (1983-05-01), Klettke
Matsui Masaaki
Mori Tomoyuki
Orikasa Wataru
Saito Hiroshi
Shigetomi Masayoshi
Communication Architecture and Building Research Corporation
Dawson Robert A.
Nippon Telegraph and Telephone Public Corporation
Sho-Bond Construction Co., Ltd.
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