Apparatus for aligning wires to solder pads

Details Apparatus for aligning wires to solder pads Apparatus for aligning wires to solder pads

1986-10-15

1988-01-12

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29760, 29850, H05K 1300, H05K 1306

Patent

active

047181648

ABSTRACT:
A wire guide device includes a base fixture to which a microelectronic component is fixedly attached such that solder pads on the component are exposed. A lacette consisting of a plurality of spaced, upstanding posts is positioned adjacent the microelectronic component such that the posts are aligned with the solder pads. Fine wire is directed around the posts over the solder pads to a wire guide. The wire guide holds each laced wire in position for soldering.

REFERENCES:
patent: 3463898 (1969-08-01), Takaoka et al.
patent: 3608190 (1971-09-01), Steranko et al.
patent: 3626590 (1971-12-01), Miller
patent: 4461946 (1984-07-01), Kratschmer

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