Apparatus for aligning and soldering multiple electrode pedestal

Details Apparatus for aligning and soldering multiple electrode pedestal Apparatus for aligning and soldering multiple electrode pedestal

1977-12-07

1980-03-25

Moon, Charlie T.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

29729, 29821, B23K 112

Patent

active

041946685

ABSTRACT:
An apparatus for aligning and soldering electrode pedestals to the solderable ohmic contacts of individual semiconductor components formed by an undivided silicon wafer. The apparatus includes a soldering assembly for receiving the undivided silicon wafer and for temporarily retaining the electrode pedestals in alignment on the silicon wafer during the soldering of the pedestals to the ohmic contacts; a pedestal mask which is placed over the undivided silicon wafer and which aligns individual pedestals over the ohmic contacts of the silicon wafer; and a shaker apparatus coupled to said soldering base plate for distributing the electrode pedestals to each of the ohmic contacts.

REFERENCES:
patent: 3080841 (1963-03-01), Nobel
patent: 3369290 (1968-02-01), Mayer et al.
patent: 3414962 (1968-12-01), Altamura
patent: 3736651 (1973-08-01), Law et al.
patent: 3982979 (1976-09-01), Hentz et al.
patent: 4018373 (1977-04-01), Beerwerth et al.

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