Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With casting – plastic molding – or extruding means
Patent
1986-10-31
1989-12-19
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With casting, plastic molding, or extruding means
156231, 156578, 118239, 118257, 425105, B29B 1500, B44C 116, B05C 100, B05C 114
Patent
active
048880825
ABSTRACT:
A method and apparatus for applying hot melt adhesive to the parting surfaces of sections of a foam pattern employed in the lost foam metal casting process includes an adhesive applicator operable to dispense a layer of adhesive in a desired pattern onto a transfer surface. The parting surface of a section of a foam pattern is then brought into engagement with the transfer surface so that at least a portion of the adhesive adheres to the parting surface for assembly with a mating section of the foam pattern. The adhesive remaining on the transfer surface after engagement with the parting surface is scraped off and a new layer of adhesive applied in preparation for another section of the foam pattern.
REFERENCES:
patent: 3418188 (1968-12-01), Hogg et al.
patent: 3853663 (1974-12-01), McGlashen
patent: 3884749 (1975-05-01), Pankoke
patent: 3989569 (1976-11-01), Newman
patent: 4003333 (1977-01-01), Eichorn et al.
patent: 4070987 (1978-01-01), Gross et al.
patent: 4077831 (1978-03-01), Snellman et al.
patent: 4515103 (1985-05-01), Greig
patent: 4556627 (1985-12-01), Sullivan
patent: 4588470 (1986-05-01), Abegglea
Nordson (advertisement) "Hot Paste Speeds Core Assembly", Sep. 1977.
The Replicast CS Process by Ashton et al., Scrata No. 64, pp. 1-11, Mar., 1984.
Patent Abstracts of Japan, vol. 10, No. 375 (M-545)(2432), Dec. 13, 1986 & JP, A, 61169134 (Toyota Motor Corp.) Jul. 30, 1986.
Fetcenko Raymond M.
Wydro Jan
Zuponcic Ralph P.
Ball Michael W.
Falasco Louis
Nordson Corporation
LandOfFree
Apparatus for adhesive transfer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for adhesive transfer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for adhesive transfer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1900907