Apparatus for adapting semiconductor die pads and method therefo

Details Apparatus for adapting semiconductor die pads and method therefo Apparatus for adapting semiconductor die pads and method therefo

1992-12-21

1994-08-30

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 174260, 361767, H05K 109

Patent

active

053429990

ABSTRACT:
A carrier allows a semiconductor die to be flip-chip mounted to a printed wiring board. Many carriers are formed together in an array. A bottom pad constellation formed on one side of a carrier is compatible with the printed wiring board's layout rules. This pad constellation couples to a top pad constellation on the opposing side of the carrier through stepped vias. Conductive bumps made from an alloy of gold and a metal from the platinum family are formed on bond-pads of the die. The top pad constellation of the carrier is formed primarily from gold. The carrier's bottom pad constellation is formed from the gold/platinum alloy. Carriers and dice may be tested by probing the carrier's pad bottom constellation. After testing, solder bumps are formed on the bottom pad constellation, and the carrier is soldered to the printed wiring board.

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