Apparatus for achieving printed circuit board planarity

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29740, H05K 330

Patent

active

054918898

ABSTRACT:
According to the present invention, a system for placing surface mount components on a planar PCB has a placement apparatus which picks up a surface mount component to be placed on the PCB and moves it along the x and y axes to the desired PCB component location. The placement apparatus then moves a predetermined vertical distance towards the PCB. Next, a contact apparatus of the system having a spring bias force moves in a vertical direction towards the PCB until it makes contact with the PCB at a location in close proximity to the PCB component location. The contact apparatus has a spring bias force which holds the PCB planar at the PCB component location so that the surface mount component may be placed on the PCB.

REFERENCES:
patent: 4290732 (1981-09-01), Taki et al.
patent: 4738025 (1988-04-01), Arnold
patent: 5105532 (1992-04-01), Fritsch

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