Apparatus for accurately bonding leads to a semi-conductor die o

Details Apparatus for accurately bonding leads to a semi-conductor die o Apparatus for accurately bonding leads to a semi-conductor die o

1974-09-30

1977-03-08

Smith, Al Lawrence

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 55, 226 58, 228105, H01L 21601

Patent

active

040108856

ABSTRACT:
Apparatus for accurately bonding leads to a semi-conductor die or the like includes a hitch feed and guide assembly for sequentially positioning each set of leads on a film carrier format over the die to be bonded to the leads. A micromanipulator adjusts the leads relative to the die prior to bonding. Displacement means provide unambiguous rectilinear separate movement of the bonding tool laterally into alignment with the lead and semi-conductor and then into contact with the leads to apply bonding heat and pressure.

REFERENCES:
patent: 1984143 (1934-12-01), Kraft
patent: 3611561 (1971-10-01), Dosier
patent: 3628717 (1971-12-01), Lynch et al.
patent: 3689991 (1972-09-01), Aird
patent: 3696985 (1972-10-01), Herring et al.
patent: 3698618 (1972-10-01), Helda
patent: 3709424 (1973-01-01), Drees
patent: 3722072 (1973-03-01), Beyerlein
patent: 3724068 (1973-04-01), Galli
patent: 3739463 (1973-06-01), Aird et al.
patent: 3831252 (1974-08-01), Miller

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