Apparatus for accomplishing solder bonding

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

Patent

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Details

29759, 29760, 228 441A, 269 41, 269254R, B23K 3704

Patent

active

041252160

ABSTRACT:
Conductor wires are laid in parallel, one between a respectively associated pair of the coils of a helically wound coil spring while the coils are separated. Thereafter, the coils are moved together so that the conductor wires are pinched between them. One end of each of the wires is fluxed and then tinned with solder in dipping steps. Subsequently, the conductor wires are disposed in respectively associated ones of a series of parallel grooves formed in a conductor holder. The grooves are directed toward cavities in which elements to which the wires are to be bonded are suspended. The conductors are urged into engagement with those elements and hot air is made to flow into the cavity where the solder tinning is rendered molten whereby solder bonding is effected when the supply of hot air is terminated. The process is facilitated by the use of stops in conjunction with a coiled spring such that the conductor wires have their ends arranged in a common line prior to dipping and tinning. The process is further facilitated by employment of a conductor retaining element in conjunction with the wire holding element. The retaining element rests atop the holding element so that the conductors are confined against all but longitudinal movement through the grooves in the direction of the electrical elements to which they are to be bonded.

REFERENCES:
patent: 2584297 (1952-02-01), Schmuldt

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