Apparatus for abrading workpieces, particularly semiconductor wa

Details Apparatus for abrading workpieces, particularly semiconductor wa Apparatus for abrading workpieces, particularly semiconductor wa

1982-06-16

1984-12-25

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

B24B 708

Patent

active

044895216

ABSTRACT:
An apparatus for abrading workpieces, particularly a semiconductor wafer, includes a spinner plate having acentral support and a finger pocket at one end to rotate the plate about a collar that is affixed to the central part of an abrading plate. The spinner plate carries at its end opposite the finger pocket, a fixture used to support the workpiece for movement along a circular track on the abrading plate. The abrading plate is supported within a tray.

REFERENCES:
patent: 1046505 (1912-12-01), Stuart
patent: 1069329 (1913-08-01), Gronbech
patent: 1217981 (1917-03-01), Nasief
patent: 2218724 (1937-08-01), Rudd
patent: 3978622 (1976-09-01), Mazur

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