Apparatus embodying doped substrate portion

Details Apparatus embodying doped substrate portion Apparatus embodying doped substrate portion

2007-12-04

2007-12-04

Martin, J. San (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S363000

Reexamination Certificate

active

11049116

ABSTRACT:
A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.

REFERENCES:
patent: 6794958 (2004-09-01), Philliber et al.
patent: 2004/0021400 (2004-02-01), Bradley et al.
patent: 2004/0061619 (2004-04-01), Kim et al.
patent: 2005/0035828 (2005-02-01), Kyoung et al.
patent: 2007/0052046 (2007-03-01), Chu et al.
patent: 2007/0113661 (2007-05-01), Benzel et al.

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