Cleaning and liquid contact with solids – Apparatus – Automatic controls
Patent
1991-10-18
1994-01-04
Stinson, Frankie L.
Cleaning and liquid contact with solids
Apparatus
Automatic controls
134902, 134155, 134186, 134105, 1341021, B08B 310
Patent
active
052751848
ABSTRACT:
A dipping type wafer treatment apparatus includes a treatment solution bath capable of forming a uniform rising flow of a treatment solution inside from an inlet to an outlet, a treatment solution supplying unit for supplying a treatment solution at a constant velocity to the inlet of the treatment solution bath to form a uniform rising flow of the treatment solution inside the treatment solution bath and a device for dipping and retrieving the wafer into and out of the uniform flow of the treatment solution. The treatment solution is supplied from the inlet in the treatment solution bath and drown off through an outlet of the treatment solution bath. Accordingly, the treatment solution can be rapidly substituted, and the wafers to no experience contact with air during replacement of the treatment solutions.
REFERENCES:
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patent: 4736758 (1988-04-01), Kusuhara
patent: 4895604 (1990-01-01), Hayashi
patent: 4967777 (1990-11-01), Takayama et al.
patent: 4985722 (1991-01-01), Ushijima et al.
patent: 5081733 (1992-01-01), Kudo
Araki Hiroyuki
Nishizawa Hisao
Nomura Yoshio
Dainippon Screen Mfg. Co,. Ltd.
Stinson Frankie L.
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