Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
2007-10-02
2007-10-02
Kim, Paul D. (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S603120, C029S603130, C029S603160, C029S603180, C029S729000, C216S088000, C216S089000, C438S692000, C438S693000, C451S005000, C451S028000, C451S041000, C451S527000, C451S530000
Reexamination Certificate
active
11140445
ABSTRACT:
An apparatus and system for precise lapping of recessed and protruding elements in a workpiece is disclosed. According to one embodiment, a system is provided having an air bearing surface with electrical components embedded therein to provide a desired surface dimension thereof. The described system embodiment comprises a non-abrasive lapping plate having a lapping surface with a plurality of grooves therein, a support structure for supporting a workpiece such that an air bearing surface thereof is exposed, and a non-abrasive liquid. When the non-abrasive liquid is dispensed between the air bearing surface and the lapping plate, the lapping plate contacts the air bearing surface such that the air bearing surface is lapped solely by the grooves in the lapping plate. The electrical components of the air bearing surface are lapped such that they are substantially uniform in dimension relative to the air bearing surface.
REFERENCES:
patent: 5968238 (1999-10-01), Healy et al.
patent: 5981396 (1999-11-01), Robinson et al.
patent: 6050879 (2000-04-01), Dubrovskiy et al.
patent: 6383239 (2002-05-01), Suzuki et al.
patent: 6444132 (2002-09-01), Orii et al.
patent: 402075780 (1990-03-01), None
Guzzo et al., “Effect of Crystal Orientation on Lapping and Polishing Processes of Natural Quartz”, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, Sep. 2000, pp. 1217-1227, vol. 47, No. 5.
Chang Yu-En Percy
Markevitch Yuri
McMaster Mark C.
Amaniampong Duke
Dillon & Yudell LLP
Hitachi Global Storage Technologies - Netherlands B.V.
Kim Paul D.
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