Apparatus and process for the production of micro-pore free high

Details Apparatus and process for the production of micro-pore free high Apparatus and process for the production of micro-pore free high

1989-09-21

1990-09-11

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 104

Patent

active

049560530

ABSTRACT:
A process and apparatus for producing metal foil comprises supplying an isotopically polished continuous cathode, a high volume turbulent flow of electrolyte and rigorous filtration to exclude chlorides, sulfides, organics and other impurities from the electrolyte. The foil so produced is free from micro-voids and able to withstand substantially higher biaxial stresses than conventional electrodeposited foil. The micro void free structure also decreases the diffusion rate of an underlying substrate.

REFERENCES:
patent: 1417464 (1922-05-01), Edison
patent: 1543861 (1924-05-01), McCord
patent: 2044415 (1936-06-01), Yates
patent: 2387236 (1966-11-01), Brugger
patent: 3461046 (1969-08-01), Clancy
patent: 3660251 (1972-05-01), Flumann
patent: 4529486 (1985-07-01), Polan
patent: 4549950 (1985-10-01), Polan et al.
patent: 4647345 (1987-03-01), Polan
Electroplating Engineering Handbook, edited by A. Kenneth Graham, 1962, p. 724.
Copper Foil for Printed Wiring Application, published in the IPC Standard 1981 edition.

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