Chemistry: electrical and wave energy – Processes and products
Patent
1984-12-31
1987-03-24
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
204 28, 204206, C25D 706
Patent
active
046523464
ABSTRACT:
The present invention relates to a process and apparatus for forming a substantially uniform electrodeposit on a metal or metal alloy foil. The apparatus includes a frame assembly for substantially preventing bowing and/or flapping of the metal or metal alloy foil and for promoting substantially uniform electrodeposits by maintaining the gap between the foil and each treatment anode substantially constant. The process and apparatus have particular utility in the treatment of delicate copper foil for use in electronic and electrical applications.
REFERENCES:
patent: 1952762 (1934-03-01), Levy et al.
patent: 2461556 (1949-02-01), Lorig
patent: 3567595 (1974-04-01), Yates
patent: 3803013 (1971-03-01), Yates
patent: 3855083 (1974-12-01), Hoeckelman
patent: 3864235 (1975-02-01), Bobrov et al.
patent: 4118302 (1978-10-01), Govert
patent: 4119515 (1978-10-01), Costakis
patent: 4132609 (1979-01-01), Bush et al.
patent: 4163704 (1979-08-01), Murata
patent: 4426266 (1984-01-01), Ukena et al.
patent: 4432854 (1984-02-01), Takahashi et al.
patent: 4468293 (1984-08-01), Polan et al.
patent: 4469565 (1984-09-01), Hampel
patent: 4526668 (1985-07-01), Podrini
Cohn Howard M.
Kelmachter Barry L.
Leader William T.
Niebling John F.
Olin Corporation
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