Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent
1996-03-19
1998-06-02
Ramsey, Kenneth J.
Metal fusion bonding
Process of disassembling bonded surfaces, per se
228 19, B23K 1018
Patent
active
057588171
ABSTRACT:
An apparatus comprises (a) at least one heater to heat a printed wiring assembly until solder holding selected electrical components reaches a flow temperature; (b) a presence detector to determine when the printed wiring assembly is properly positioned at a first location after the printed wiring assembly (particularly, the solder holding the electrical components) has been heated by the heater(s); and (c) a vibrator positioned to vibrate a selected portion of the printed wiring board of the printed wiring assembly with a first vibrating intensity for a first time period. The first vibrating intensity and the first time period must be of sufficient strength and duration to detach the selected electrical component(s) from the printed wiring assembly. The presence detector is electrically coupled to the mechanical vibrator to activate the mechanical vibrator when the printed wiring assembly is positioned at the first location. A transport mechanism automatically transports the printed wiring assembly past the heater(s) to the first location. A first transporting conveyor extends from the first location to a second location, which catches and transports the selected electrical component(s) away from the first location. A second transporting conveyor extending from first location to catch and transport the printed wiring board and any remaining electrical components attached thereto of the printed wiring assembly away from the first location. Processes comprise the following steps: (a) heating the printed wiring assembly until the solder reaches a flow temperature; (b) automatically transferring and positioning the printed wiring assembly to a first position; and (c) automatically vibrating a selected portion of the printed wiring board of the printed wiring assembly with a first intensity for a first time period.
REFERENCES:
patent: 4561584 (1985-12-01), Hug
patent: 4775776 (1988-10-01), Rahn et al.
patent: 5148969 (1992-09-01), Boucher et al.
IBM Tech, Disclosure Bulletin vol. 28, No. 1 Jun. 1985 pp. 178-179.
Burke R. Darryl
Ramsey Kenneth J.
Resource Concepts, Inc.
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