Apparatus and process for direct cooling an emerging ingot with

Details Apparatus and process for direct cooling an emerging ingot with Apparatus and process for direct cooling an emerging ingot with

1991-08-14

1992-06-09

Batten, Jr., J. Reed

Metal founding

Process

Shaping liquid metal against a forming surface

164444, B22D 1104, B22D 11124

Patent

active

051198835

ABSTRACT:
A body of partially solidified metal emerging as ingot from the exit end 10 of an open ended mold 2, is direct cooled by charging liquid coolant into an annular retention chamber 32 circumposed about the exit end opening of the mold in the body thereof, and discharging the coolant from the chamber onto the surface of the ingot through a first passage 14 opening into the exit end of the mold and communicating with the chamber at an opening 50 therein. At times, such as in the butt-forming stage, a second passage 46 is formed in the chamber which is serially interconnected with the first passage 14 at the chamber opening 50 and operable to deliver the chamber coolant to the first passage at an increased rate of flow, relative to the rate at which the coolant was charged into the chamber. Pressurized gas is forced into the coolant flow through a body 72 of solid but porous, gas-permeable material that is incorporated into the wall 60 of the second passage at a surface thereof which extends generally parallel to the flow of coolant in the second passage. In this way, the coolant is amended to discharge through the first passage 14 in a discontinuous liquid phase in which it is laden with bubbles of undissolved gas that will alter the heat transfer characteristics of the coolant on the surface of the ingot to vary the rate at which heat is lost therefrom.

REFERENCES:
patent: 3713479 (1973-01-01), Bryson
patent: 4166495 (1979-09-01), Yu
patent: 4200138 (1980-04-01), Hildebrandt
patent: 4597432 (1986-07-01), Collins et al.
patent: 4598763 (1986-07-01), Wagstaff et al.
patent: 4693298 (1987-09-01), Wagstaff
patent: 4732209 (1988-03-01), Apostolov et al.

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