Apparatus and methods of forming an interconnect between a...

Details Apparatus and methods of forming an interconnect between a... Apparatus and methods of forming an interconnect between a...

2008-05-01

2010-11-30

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257SE23023, C257SE21508, C438S612000

Reexamination Certificate

active

07843075

ABSTRACT:
Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.

REFERENCES:
patent: 7032513 (2006-04-01), Onishi et al.
patent: 7166491 (2007-01-01), Wilson et al.
patent: 7592707 (2009-09-01), Krishnamoorthy et al.
patent: 2003/0013228 (2003-01-01), Hotchkiss et al.
patent: 2007/0246516 (2007-10-01), Cordes et al.

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