Apparatus and methods for transporting and processing...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With means for passing discrete workpiece through plural...

Reexamination Certificate

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C156S345310, C118S719000, C204S298250, C204S298350

Reexamination Certificate

active

07901539

ABSTRACT:
There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.

REFERENCES:
patent: 4951601 (1990-08-01), Maydan et al.
patent: 2004/0151562 (2004-08-01), Hofmeister et al.
patent: 2006/0102078 (2006-05-01), Fairbairn et al.
patent: 08119409 (1996-05-01), None

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