X-ray or gamma ray systems or devices – Specific application – Diffraction – reflection – or scattering analysis
Reexamination Certificate
2005-06-21
2005-06-21
Church, Craig E. (Department: 2882)
X-ray or gamma ray systems or devices
Specific application
Diffraction, reflection, or scattering analysis
Reexamination Certificate
active
06909774
ABSTRACT:
Apparatus and methods are disclosed for milling selected regions on the surface of a multilayer-film reflective surface of an X-ray mirror to correct the reflected wavefront produced by the mirror, thereby producing a more uniform or otherwise more desirable phase distribution of the reflected wavefront. The milled multilayer films include multiple lamina sets each including respective layers of at least two respective substances. The layers usually are “stacked” alternatingly at a fixed period length on a mirror substrate. By selectively removing one or more surficial layers in selected locations, local corrections of the phase shift of the reflective wavefront are achieved. At each milling location, the depth profile can be stepwise or smoothly gradated. Milling methods can include lapping, ion-beam bombardment, plasma-enhanced chemical vapor machining (CVM), reactive-ion etching, photochemical reactions, or laser ablation.
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Kondo Hiroyuki
Murakami Katsuhiko
Oshino Tetsuya
Sugisaki Katsumi
Yamamoto Masaki
Church Craig E.
Klarquist & Sparkman, LLP
Nikon Corporation
Yun Jurie
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