Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1997-08-15
1999-08-03
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
438693, 216 88, 216 89, H01L 2100
Patent
active
059324864
ABSTRACT:
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution essentially free from particulate matter.
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Budinger William D.
Cook Lee Melbourne
James David B.
Benson Kenneth A.
Kaeding Konrad H.
Powell William
Rodel Inc.
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