Apparatus and methods for recirculating chemical-mechanical poli

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

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438693, 216 88, 216 89, H01L 2100

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active

059324864

ABSTRACT:
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution essentially free from particulate matter.

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"Lapping: Polishing and Shear Mode Grinding", Norman J. Brown, Lawrence Livermore Nat. Lab.
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Cook, Lee M., "Chemical Processes in Glass Polishing," Journal of Non-Crystalline Solids 120, pp. 152-171, 1990.

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