Apparatus and methods for recirculating chemical-mechanical poli

Details Apparatus and methods for recirculating chemical-mechanical poli Apparatus and methods for recirculating chemical-mechanical poli

1999-07-29

2000-02-29

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438691, 156345, H01L 2100

Patent

active

060308990

ABSTRACT:
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution free from particulate matter.

REFERENCES:
patent: 3549439 (1970-12-01), Kaveggia et al.

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