Apparatus and methods for packaging integrated circuit chips...

Communications: radio wave antennas – Antennas – Microstrip

Reexamination Certificate

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C343S841000

Reexamination Certificate

active

11332737

ABSTRACT:
Apparatus and methods are provided for packaging IC chips together with integrated antenna modules designed to provide a closed EM (electromagnetic) environment for antenna radiators, thereby allowing antennas to be designed independent from the packaging technology.

REFERENCES:
patent: 5898909 (1999-04-01), Yoshihara et al.
patent: 6087989 (2000-07-01), Song et al.
patent: 6867746 (2005-03-01), Mendolia et al.
patent: 6882319 (2005-04-01), Jinushi
patent: 7095372 (2006-08-01), Soler Castany et al.
patent: 7109925 (2006-09-01), Noro et al.
patent: 7205899 (2007-04-01), Surkau

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