Apparatus and methods for packaging antennas with integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension

Reexamination Certificate

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C257S676000

Reexamination Certificate

active

11231919

ABSTRACT:
Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.

REFERENCES:
patent: 6373447 (2002-04-01), Rostoker et al.

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