Apparatus and methods for packaging antennas with integrated...

Details Apparatus and methods for packaging antennas with integrated... Apparatus and methods for packaging antennas with integrated...

2008-03-11

2008-03-11

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With means for controlling lead tension

C257S676000

Reexamination Certificate

active

07342299

ABSTRACT:
Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.

REFERENCES:
patent: 6373447 (2002-04-01), Rostoker et al.

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