Apparatus and methods for optically monitoring thickness

Details Apparatus and methods for optically monitoring thickness Apparatus and methods for optically monitoring thickness

2005-08-30

2005-08-30

Smith, Zandra V. (Department: 2877)

Optics: measuring and testing

Dimension

Thickness

C356S485000

Reexamination Certificate

active

06937350

ABSTRACT:
In one aspect, the invention relates to an apparatus for monitoring thickness variations of an object having first and second opposing surfaces. The apparatus includes a first source positioned to project a first fringe pattern at a first location on the first surface and a second source positioned to project a second fringe pattern at a first location on the second surface. The apparatus further includes a first detector positioned to detect the first fringe pattern at the first location on the first surface, the first detector generating a first signal in response to the first fringe pattern at the first location. The apparatus also includes a second detector positioned to detect the second fringe pattern at the first location on the second surface, the second detector generating a second signal in response to the second fringe pattern at the first location. The apparatus further includes a processor adapted to calculate variations in the thickness of the object in response to the first and the second signals.

REFERENCES:
patent: 3720471 (1973-04-01), Kasahara et al.
patent: 3749500 (1973-07-01), Carlson et al.
patent: 3828248 (1974-08-01), Wennerberg
patent: 3994589 (1976-11-01), Nodwell et al.
patent: 4068955 (1978-01-01), Bodlaj
patent: 4260649 (1981-04-01), Dension et al.
patent: 4311392 (1982-01-01), Yazaki et al.
patent: 4340617 (1982-07-01), Deutsch et al.
patent: 4359485 (1982-11-01), Donnelly et al.
patent: 4541723 (1985-09-01), Pirlet
patent: 4542297 (1985-09-01), Hold
patent: 4622095 (1986-11-01), Grobman et al.
patent: 4641972 (1987-02-01), Halioua et al.
patent: 4722605 (1988-02-01), Livnat et al.
patent: 4751779 (1988-06-01), Nagatomo et al.
patent: 4752668 (1988-06-01), Rosenfield et al.
patent: 4794550 (1988-12-01), Greivenkamp, Jr.
patent: 4900940 (1990-02-01), Nakamura
patent: 4948460 (1990-08-01), Sandaiji et al.
patent: 5001356 (1991-03-01), Ichikawa
patent: 5003187 (1991-03-01), Zumbrunn et al.
patent: 5146293 (1992-09-01), Mercer et al.
patent: 5310624 (1994-05-01), Ehrlich
patent: 5351126 (1994-09-01), Takada et al.
patent: 5389196 (1995-02-01), Bloomstein et al.
patent: 5414513 (1995-05-01), Leib
patent: 5442573 (1995-08-01), Bredberg et al.
patent: 5473432 (1995-12-01), Sorin
patent: 5496407 (1996-03-01), McAleavey
patent: 5502564 (1996-03-01), Ledger
patent: 5617645 (1997-04-01), Wick et al.
patent: 5621529 (1997-04-01), Gordon et al.
patent: 5659392 (1997-08-01), Marcus et al.
patent: 5666197 (1997-09-01), Guerra
patent: 5666394 (1997-09-01), Swanson
patent: 5696589 (1997-12-01), Bernacki
patent: 5761066 (1998-06-01), Lettau et al.
patent: 5805291 (1998-09-01), Calvin et al.
patent: 5811826 (1998-09-01), Shirley
patent: 5870191 (1999-02-01), Shirley et al.
patent: 5874011 (1999-02-01), Ehrlich
patent: 5900936 (1999-05-01), Shirley et al.
patent: 5995226 (1999-11-01), Abe et al.
patent: 6031612 (2000-02-01), Shirley
patent: 6049384 (2000-04-01), Rudd et al.
patent: 6100977 (2000-08-01), Muller
patent: 6229619 (2001-05-01), Shirley
patent: 6341015 (2002-01-01), Shirley
patent: 6438272 (2002-08-01), Huang et al.
patent: 2001/0012388 (2001-08-01), Muller et al.
patent: 28 50 092 (1980-05-01), None
patent: 44 04 663 (1995-08-01), None
patent: 4415834 (1995-11-01), None
patent: 4415834 (1995-11-01), None
patent: 19543347 (1997-05-01), None
patent: 0 864 847 (1998-09-01), None
patent: 0 864 847 (1998-09-01), None
patent: 2 595 815 (1997-09-01), None
patent: 06117824 (1994-04-01), None
patent: WO 97/29341 (1997-08-01), None
PCT International Search Report for International Application No.: PCT/US02/20516 (2002).

Affiliated with

Also associated with

Rating

Apparatus and methods for optically monitoring thickness does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and methods for optically monitoring thickness, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and methods for optically monitoring thickness will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3511114