Metal fusion bonding – Process – Repairing – restoring – or renewing product for reuse
Patent
1992-12-23
1994-02-22
Ramsey, Kenneth J.
Metal fusion bonding
Process
Repairing, restoring, or renewing product for reuse
228111, 228205, 22818021, 2281791, B23K 2010
Patent
active
052880079
ABSTRACT:
The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.
REFERENCES:
patent: 3274331 (1966-09-01), Quigley
patent: 3396892 (1968-08-01), Balamuth
patent: 3406246 (1968-11-01), Davidson et al.
patent: 3458102 (1969-07-01), Zanger et al.
patent: 3463898 (1969-08-01), Takaoka et al.
patent: 3535769 (1970-10-01), Goldschmied
patent: 3568307 (1971-03-01), Zanger et al.
patent: 3690538 (1972-09-01), Gaiser et al.
patent: 3695502 (1972-10-01), Gaiser
patent: 3762040 (1973-10-01), Burns et al.
patent: 3955740 (1976-05-01), Shoh
patent: 4030657 (1977-06-01), Scheffer
patent: 4184623 (1980-01-01), Strasser
patent: 4247590 (1981-01-01), Hayakawa
patent: 4259367 (1981-03-01), Dougherty, Jr.
patent: 4418264 (1983-11-01), Thorwarth
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4630355 (1986-12-01), Johnson
patent: 4667867 (1987-05-01), Dobbs et al.
patent: 4683652 (1987-08-01), Hatfield
patent: 4691855 (1987-09-01), Yagi
patent: 4776509 (1988-10-01), Pitts et al.
patent: 4778097 (1988-10-01), Hauser
patent: 4781319 (1988-11-01), Deubzer et al.
patent: 4908938 (1990-03-01), Thorwarth
patent: 4912843 (1990-04-01), Dederer
patent: 4952257 (1990-08-01), Forler
patent: 4967950 (1990-11-01), Legg et al.
patent: 4970365 (1990-11-01), Chalco
patent: 5079070 (1992-01-01), Chalco et al.
Semiconductor International "Discrete Wire Bonding Using Laser Energy" by Chaleo et al May 1988 pp. 130-131.
Avedissian "Multidirectional Ultrasonic Wire bonding Tip" Tech. Digest No. 20 (Western Electric), Oct. 1970, pp. 7-8.
Fowler "Double Element Bonding Head" Tech Digest No. 12 (Western Electric) Oct. 1968; p. 9.
IBM TDB, vol. 8, No. 11, Apr. 1966, p. 1469, "Repairing Breaks in Printed Circuits".
IBM TDB, vol. 11, No. 7, Dec. 1968, p. 876, "Solder Coating Thin Copper Wire".
IBM TDB, vol. 14, No. 5, Oct. 1971, p. 1359, "Soldering Device".
IBM TDB, vol. 14, No. 10, Mar. 1972, p. 2915, "Open Conductor Repair for Glass Metal Module".
IBM TDB, vol. 15, No. 8, Jan. 1973, p. 2423, "Conductive Line Jumper/Repair connection in Glass Metal Module".
IBM TDB, vol. 16, No. 4, Sep. 1973, p. 1153 "Flexible Circuit Package for Mechanical Thermal Pulse Bonding".
IBM TDB, vol. 18, No. 12, May 1976, p. 3984, "Individually Controllable Wire Solder Reflow Bonding Tip".
IBM TDB, vol. 22, No. 9, Feb. 1980, pp. 3986-3987, "Circuit Repair/work of Metalized Polyimide Substrates".
IBM TDB, vol. 26, No. 12, May 1984, pp. 6244-6245, "Josephson Package Repair".
IBM TDB, vol. 27, No. 5, Oct. 1984, p. 3401, "Thermo-Compression Bonding
IBM TDB, vol. 29, No. 2, Jul. 1986, pp. 720-721, "Automatic Soldering Machine for Fine-Wire Connections".
IBM TDB, vol. 31, No. 2, Jul. 1988, pp. 312-313, "Automated Point-to-Point Soldering Workstation".
IBM TDB, vol. 31, No. 6, Nov. 1988, pp. 236-237, "Equal Force Planarity Device".
IBM TDB, vol. 32, No. 4A, Sep. 1989, pp. 429-430, "Ablative Cleaning of Bonding Surfaces".
Micro-Swiss/Bonding Tools and Production Accessories, 1980, "Tailless Ball and Wedge Bonding Cycle", Ultrasonic Bonding Wedges; Die Collets.
Bonding Tools, 1977, pp. 18-21, "Part Two: Bonding Wedges" Gaiser Tool Company.
"Thermocompression Bonding Manual", 1976, pp. 4-11, Gaiser Tool Company.
U.S. patent application Ser. No. 07/725,415 filed on Jul. 1, 1990 entitled "Localized Soldering Station Using State Changing Medium".
Technical Digest No. 20 (Western Electric), Oct. 1970, pp. 7-8, "Multidirectional Ultrasonic Wire Bonding Tip", Avedissian.
Technical Digest No. 12 (Western Electric), Oct. 1968, p. 9, Fowler, W. H., "Double Bonding Head".
Berger Michael
Handford Edward F.
Interrante Mario J.
Tas Eugene
Ahsan Aziz M.
International Business Machine Corporation
Ramsey Kenneth J.
LandOfFree
Apparatus and methods for making simultaneous electrical connect does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and methods for making simultaneous electrical connect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and methods for making simultaneous electrical connect will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-166477