Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1994-06-02
1995-04-25
Heinrich, Samuel M.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228 42, B23K 100, B23K 300
Patent
active
054091594
ABSTRACT:
A circuit board is wave soldered as it is carried by a conveyor through a solder wave established in a solder reservoir. Disposed on both sides of the solder wave are gas plenums which discharge shield gas. Each gas plenum includes a top wall, a side wall, and a bottom wall. The side wall is spaced horizontally from the wave, and the bottom wall is submerged within the solder. The side and (optionally) top walls include orifices for directing shield gas (i) at high velocity toward the solder wave to protect the solder wave with an atmosphere of shield gas, and (ii) upwardly toward an underside of the circuit board to strip entrained air therefrom. Instead of being submerged within the solder, the bottom wall could be spaced above the solder and provided with orifices to emit shield gas downwardly between the plenum and solder reservoir to create an inert atmosphere above the solder. Dividers disposed within the plenum form sub-chambers communicating with orifices in respective walls of the plenum so that different gas velocities can be entitled from the orifices. The gas plenums can be rotatably adjustable and further adjustable either vertically or horizontally.
REFERENCES:
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 4538757 (1985-09-01), Bertiger
patent: 4606493 (1986-08-01), Christoph et al.
patent: 4610391 (1986-09-01), Nowstarsky
patent: 4646958 (1987-03-01), Howard, Jr.
patent: 4746289 (1988-05-01), Guillaume
patent: 4821947 (1989-04-01), Nowotarski
patent: 4921156 (1990-05-01), Hohnerlein
patent: 5044542 (1991-09-01), Deambrosio
patent: 5048746 (1991-09-01), Elliott et al.
patent: 5071058 (1991-12-01), Nowotarski
patent: 5121874 (1992-06-01), Deambrosio et al.
patent: 5121875 (1992-06-01), Hagerty et al.
patent: 5193734 (1993-03-01), Takayama et al.
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5240169 (1993-08-01), Gileta
patent: 5292055 (1994-03-01), Gileta
patent: 5294036 (1994-03-01), Den Dopper
Connors Robert W.
Giacobbe Frederick W.
Jurcik, Jr. Benjamin J.
McKean Kevin P.
Rotman Frederic
Air Liquide America Corp.
American Air Liquide Inc.
Heinrich Samuel M.
L'Air Liquide Societe Anonyme pour l'Etude et, l'Exploitation de
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