Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-07-01
2008-07-01
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S717000, C361S719000, C257S706000, C257S707000, C257S713000
Reexamination Certificate
active
07394659
ABSTRACT:
The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.
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Colgan Evan George
Goth Gary
Sylvester Deborah Anne
Zitz Jeffrey Allen
F. Chau & Associates LLC
International Business Machines - Corporation
Trepp Robert M.
Vortman Anatoly
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