Apparatus and methods for cooling a processor socket

Electrical connectors – With provision to dissipate – remove – or block the flow of heat

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S198000, C439S487000

Reexamination Certificate

active

06840794

ABSTRACT:
Contact pin temperature of a semiconductor package is reduced by forcing air into a region between a circuit board and a socket body. A sealant around the perimeter of the socket body at least in part seals the socket body with the circuit board, allowing the forced gas to flow through cavities containing the contacts, thereby cooling the contacts and the package pins. The contact-pin temperature may be reduced, allowing power pins to carry more current. Accordingly, microprocessors and processing systems may be operated at higher data rates without reducing reliability or increasing contact-pin oxidation.

REFERENCES:
patent: 3989331 (1976-11-01), Hanlon
patent: 4638348 (1987-01-01), Brown et al.
patent: 4820976 (1989-04-01), Brown
patent: 5083194 (1992-01-01), Bartilson
patent: 5562462 (1996-10-01), Matsuba et al.
patent: 5578870 (1996-11-01), Farnsworth et al.
patent: 6128188 (2000-10-01), Hanners
patent: 6357023 (2002-03-01), Co et al.
patent: 6514103 (2003-02-01), Pape et al.
patent: 2000-294965 (2000-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and methods for cooling a processor socket does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and methods for cooling a processor socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and methods for cooling a processor socket will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3373650

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.