Electrical connectors – With provision to dissipate – remove – or block the flow of heat
Reexamination Certificate
2005-01-11
2005-01-11
Zarroli, Michael C. (Department: 2839)
Electrical connectors
With provision to dissipate, remove, or block the flow of heat
C439S198000, C439S487000
Reexamination Certificate
active
06840794
ABSTRACT:
Contact pin temperature of a semiconductor package is reduced by forcing air into a region between a circuit board and a socket body. A sealant around the perimeter of the socket body at least in part seals the socket body with the circuit board, allowing the forced gas to flow through cavities containing the contacts, thereby cooling the contacts and the package pins. The contact-pin temperature may be reduced, allowing power pins to carry more current. Accordingly, microprocessors and processing systems may be operated at higher data rates without reducing reliability or increasing contact-pin oxidation.
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Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
Zarroli Michael C.
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