Apparatus and methods for cooling a processor socket

Details Apparatus and methods for cooling a processor socket Apparatus and methods for cooling a processor socket

2005-01-11

2005-01-11

Zarroli, Michael C. (Department: 2839)

Electrical connectors

With provision to dissipate, remove, or block the flow of heat

C439S198000, C439S487000

Reexamination Certificate

active

06840794

ABSTRACT:
Contact pin temperature of a semiconductor package is reduced by forcing air into a region between a circuit board and a socket body. A sealant around the perimeter of the socket body at least in part seals the socket body with the circuit board, allowing the forced gas to flow through cavities containing the contacts, thereby cooling the contacts and the package pins. The contact-pin temperature may be reduced, allowing power pins to carry more current. Accordingly, microprocessors and processing systems may be operated at higher data rates without reducing reliability or increasing contact-pin oxidation.

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