Metal working – Method of mechanical manufacture – Assembling or joining
Reexamination Certificate
2005-11-29
2005-11-29
Omgba, Essama (Department: 3726)
Metal working
Method of mechanical manufacture
Assembling or joining
C029S469000, C312S334100, C312S334400
Reexamination Certificate
active
06968606
ABSTRACT:
An assembly has a frame that defines at least one opening and a subsystem that is movable relative to the frame. At least one slide connects the subsystem to the frame such that the weight of the subsystem transmits a force to the slide. The slide includes at least one projection that extends through the at least one opening in the frame. At least one urging member biases the projection to at least partially counter the force transmitted to the slide by the weight of the subsystem. At least one docketing pin slides into at least one docking hole with minimal vertical load on the docking hole.
REFERENCES:
patent: 3600782 (1971-08-01), Manson et al.
patent: 3649090 (1972-03-01), Dutot
patent: 4553307 (1985-11-01), Kaltz et al.
patent: 5033805 (1991-07-01), Hobbs
patent: 5085523 (1992-02-01), Hobbs
patent: 5484197 (1996-01-01), Hansen et al.
patent: 5575318 (1996-11-01), Susnjara
patent: 5592728 (1997-01-01), Susnjara
patent: 5890811 (1999-04-01), Bryson
patent: 5974667 (1999-11-01), Bryson
patent: 6158123 (2000-12-01), Bryson
patent: 6669263 (2003-12-01), Asai
patent: 6772985 (2004-08-01), Lee
patent: 6871920 (2005-03-01), Greenwald et al.
patent: 2002/0021061 (2002-02-01), Lammens
Benton Richard C.
Fromm Paul M.
Oliff & Berridg,e PLC
Omgba Essama
Xerox Corporation
LandOfFree
Apparatus and methods for connecting a movable subsystem to... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and methods for connecting a movable subsystem to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and methods for connecting a movable subsystem to... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3480708