Apparatus and methods for an underfilled integrated circuit...

Details Apparatus and methods for an underfilled integrated circuit... Apparatus and methods for an underfilled integrated circuit...

2005-12-27

2005-12-27

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

Reexamination Certificate

active

06979600

ABSTRACT:
Embodiments of the present invention include first and second substrate structures with underfill injected into a substrate structure interface through a feature of the substrate structure, a heat spreader, and the like.

REFERENCES:
patent: 5909056 (1999-06-01), Mertol
patent: 6074897 (2000-06-01), Degani et al.
patent: 6083774 (2000-07-01), Shiobara et al.
patent: 6331446 (2001-12-01), Cook et al.
patent: 6436737 (2002-08-01), Malladi
patent: 6441480 (2002-08-01), Takeuchi et al.
patent: 6756251 (2004-06-01), Lee
patent: 6815258 (2004-11-01), Vincent

Affiliated with

Also associated with

Rating

Apparatus and methods for an underfilled integrated circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and methods for an underfilled integrated circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and methods for an underfilled integrated circuit... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3515264