Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1998-06-01
2000-02-08
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205122, 205123, C25D 502
Patent
active
060224657
ABSTRACT:
An apparatus and method for customizing electrode contact placement on a semiconductor wafer while depositing and/or removing a material on a semiconductor wafer. The present invention is a adapter having at least one opening through which at least one electrode contacts the semiconductor wafer. The adapter may be designed to have multiple openings at specified locations on the adapter, thus allowing multiple electrode contacts with the semiconductor wafer at pre-specified locations. A conductive sheet may couple with the adapter to carry an electrical current from an electrical conductor to the electrode contacts placed within the openings of the adapter.
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Holtkamp William H.
Ko Wen C.
Ting Chiu H.
Brown Jonathan
Cutek Research, Inc.
Gorgos Kathryn
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