Apparatus and method to enhance hole fill in sub-micron plating

Details Apparatus and method to enhance hole fill in sub-micron plating Apparatus and method to enhance hole fill in sub-micron plating

1999-02-23

2001-02-27

Gorgos, Kathryn (Department: 1741)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S279000

Reexamination Certificate

active

06193861

ABSTRACT:

FIELD OF THE INVENTION
The invention relates to semiconductor device, flat panel and packaging manufacture. In particular, the present invention relates to an apparatus and method for enhancing filling of very small structures during plating processes.
BACKGROUND OF THE INVENTION
In the production of microelectronic devices, metal may be plated on a semiconductor for a variety of purposes. The metal may be deposited to form vias or conductive lines, such as wiring structures. Typically, metal is plated on the substrates and cells of reservoirs that hold a plating solution that includes at least one metal and/or alloy to be plated on the substrate.
Plating baths are commonly used in microelectronic device manufacture to plate at least one material, such as a metal on a substrate for a wide variety of applications. For example, plating baths may by utilized for electroplating and/or electroless plating on substrates of one or metals and/or alloys.
SUMMARY OF THE INVENTION
The present invention provides an apparatus for enhancing filling of structures on a substrate, including damascene and non-damascene structures. The apparatus includes at least one electrolyte evacuator adjacent a surface of the substrate including the structures for evacuating electrolyte from the structures. The apparatus also includes at least one electrolyte injector adjacent the surface of the substrate including the structures for injecting electrolyte into the structures.
Additionally, the present invention provides a method of enhancing filling of structures on a substrate, including damascene and non-damascene structures. The method includes exposing the surface of a substrate that includes structures to an electrolyte solution. The electrolyte solution is evacuated from the structures by arranging adjacent the surface of the substrate at least one electrolyte evacuator. The electrolyte solution is injected into the structures by arranging adjacent the surface of the substrate at least one electrolyte injector.
Still other objects and advantages of the present invention will become readily apparent by those skilled in the art from the following detailed description, wherein it is shown and described only the preferred embodiments of the invention, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.


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