Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2006-07-04
2006-07-04
Phasge, Arun S. (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S125000, C205S205000, C205S209000, C205S210000, C205S220000, C205S224000, C427S096400, C427S097100, C427S098300, C427S237000, C427S248100, C427S255230, C427S331000, C427S372200, C427S374100, C427S404000, C438S653000, C438S654000, C438S656000, C438S660000, C438S663000, C438S672000, C438S675000, 73, 73, 73, 73
Reexamination Certificate
active
07070687
ABSTRACT:
Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the barrier layer. The method continues by performing in situ surface treatment of the metal-seed layer to form a passivation layer on the metal-seed layer. In another embodiment of a method of this invention, a substrate is provided into an electroplating tool chamber. The substrate has a barrier layer formed thereon, a metal seed layer formed on the barrier layer and a passivation layer formed over the metal seed layer. The method continues by annealing the substrate in forming gas to reduce the passivation layer. A conductive material is deposited on the substrate using an electrolytic plating or electroless plating process.
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Chikarmane Vinay B.
Tsang Chi-Hwa
Intel Corporation
Ortiz Kathy J.
Phasge Arun S,.
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