Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1996-02-07
1999-12-21
Padgett, Marianne
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
216 71, 216 67, 216 23, 427535, 427536, 427240, 538694, 538710, 538723, 538725, 538729, 538730, 538735, 538743, 134 12, 438782, B04D 300, H01L 21465, H01L 214757
Patent
active
060046317
ABSTRACT:
An apparatus for removing unnecessary matter formed on an edge portion of a substrate without damaging a middle area of a top face of the substrate is provided. The substrate is supported on a stage which is in contact only with a bottom face of the substrate. An activated gas supply device is located opposed to the stage and includes a ring-shaped electrode and a cover electrode surrounding the ring-shaped electrode. The cover electrode includes a gas outlet formed therethrough. Activated species and excited molecules formed from an atmospheric plasma are blown against the edge portion of the substrate through the gas outlet. The activated species and excited molecules and unnecessary matter removed form the edge portion of the substrate through reaction with the activated species and excited molecules, is exhausted along a side face of the edge portion of the substrate and away from the middle area through an exhausting device. A carrier gas supply may be also provided to blow a carrier gas against the middle area of the substrate. The carrier gas is then conducted from the middle area to the edge portion of the substrate so that the carrier gas prevents the activated gas from moving around to the middle area of the substrate.
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59-158525 Sept. 8, 1984 Japan Abstract Only.
Padgett Marianne
Seiko Epson Corporation
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