Apparatus and method of mounting conductive ball

Details Apparatus and method of mounting conductive ball Apparatus and method of mounting conductive ball

2008-07-23

2009-10-06

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

C228S056300, C228S180220, C228S245000, C228S246000

Reexamination Certificate

active

07597233

ABSTRACT:
There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface of the inner cylinder are opened; a sieve provided in the inner cylinder, wherein the inner cylinder is partitioned into an upper space and a lower space by the sieve; an inlet port for supplying an air from an outside to the lower space of the inner cylinder; a mask provided to a lower end of the outer frame and having openings, the openings being provided to correspond to conductive ball mounting positions; and an exhaust port for exhausting an air from an upper surface of the mask to the outside and being provided to the lower end of the outer frame, wherein the inner cylinder is adapted to vibrate without being restricted by the outer frame.

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