Apparatus and method of measuring shear strain of thick...

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen

Reexamination Certificate

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C073S15000R, C073S827000, C073S842000, C073S856000

Reexamination Certificate

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07392708

ABSTRACT:
A method an apparatus for testing shear strain response of a test specimen having a thick adhesive bond line is disclosed. Method and apparatus permit the use of readily available clip-on extensometers. The apparatus and method may include the use of knife edges secured to each of two adherend components on a standard ASTM D 5656 thick adherent test specimen.

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patent: 5275057 (1994-01-01), Alexander
patent: 5335547 (1994-08-01), Nakajima et al.
patent: 5361640 (1994-11-01), Carroll et al.
L.E. Crocker and G.D. Dean. Tensile Testing of Adhesive Buss-joint Specimens. “http://midas.npl.co.uk/midas/content/ma09.html” May 2001.
“Evaluation and Adjustments for ASTM D 5656 Standard Test Method for Thick-Adherend Metal Lap-Shear Joints for Determination of the Stress-Strain Behavior of Adhesives in Shear by Tension Loading”, Yang et al., American Chemical Society, 2001, pp. 36-43.
“Shear Stress-Strain Data for Structural Adhesives”, Tomblin et al., U.S. Department of Transportation, Federal Aviation Administration, Final Report, Nov. 2002.
“Characterization of Bondline Thickness Effects in Adhesive Joints”, Tomblin et al., Journal of Composites Technology & Research, 2002, pp. 80-92.
“Model 632.02 Clip-On Gage”, MTS Systems Corporation 2001, 2 pages.

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