Registers – Records – Conductive
Patent
1996-12-03
1999-11-02
Lee, Michael G.
Registers
Records
Conductive
235488, 361737, G06K 1906
Patent
active
059754206
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to an IC card and an IC module for forming the IC card and, more specifically, to an IC card with a decreased physical failure rate in the market including those attributable to bending and the like and an IC module for forming the IC card.
BACKGROUND ART
IC cards are expected to be used in various fields owing to their high security. IC cards have attracted considerable attention as new information recording mediums, particularly, as information recording mediums that will replace magnetic cards have come into wide use recently.
Generally, an IC card is fabricated by mounting an IC module of a COB (chip-on-board) configuration on a base card. Information is written to and read from the IC module by bringing the contacts of the IC module into electrical contact with the contacts of a R/W head (read/write head).
The IC module of the IC card has a substrate, and contacts to be connected to CLK (clock) lines, I/O lines, V.sub.cc lines (power lines), RST (reset) lines, GND (grounding) lines and such are formed on one surface of the substrate, semiconductor devices included in an IC chip mounted on the other surface of the substrate are connected electrically by wires to the contacts. The IC chip is sealed in an encapsulating resin.
Elements formed on opposing surfaces of the substrate are electrically connected via through holes.
The base card of the IC card provided with the IC module is a flexible, thin polyvinyl chloride card body or the like. Therefore, physical failures are caused in the IC module sometimes by the bending of the base card and pressure being directly applied to the IC module.
One of the failures is the cracking of the IC chip. When the IC card is bent or the IC module is exposed directly to a pressure that induces a stress which the IC module is unable to withstand, cracks develop in boundaries between the contacts and the like. Some other physical failures are caused by the disconnection of the wires and the cracking of the resin.
For example, in a conventional IC module, a contact layer formed on a substrate is divided by isolation grooves formed therein across a region in which IC chips (semiconductor devices) are placed into contacts to be connected to a CLK line (clock line), an I/O line, a V.sub.cc line (power lines), a RST line (reset line), a GND line (grounding line) and such. Therefore, when the IC card is bent or a pressure is applied directly to the IC chip, a stress induced in the IC module is concentrated on portions of the substrate around the isolation grooves, and cracks often develop in those portions of the IC chip.
In most cases, cracks are liable to develop in boundary portions of the encapsulating resin on which bending stress is concentrated.
DISCLOSURE OF THE INVENTION
The present invention has been made in view of those problems and it is therefore an object of the present invention to provide an IC card in which physical failures will rarely occur, and an IC module for the IC card.
According to a first aspect of the present invention, an IC card comprises an IC module including a substrate, contacts formed on the substrate, an IC chip mounted on the substrate, and a frame surrounding the IC chip; and a base card on which the IC module is mounted. A deflection, i.e., a change in length per unit undistorted length, of the substrate is greater than that of the base card when a fixed load is applied to the IC card.
According to a second aspect of the present invention, an IC card comprises an IC module including a substrate, contacts formed on one surface of the substrate, an IC chip mounted on the other surface of the substrate, and a frame disposed on the other surface of the substrate so as to surround the IC chip; and a base card on which the IC module is mounted. The width of a contact region in which the contacts are formed is smaller than that of the substrate, the contacts are formed so that the peripheral region of the surface of the substrate is exposed to form a peripheral isolation region, the contacts a
REFERENCES:
patent: 4727246 (1988-02-01), Hara et al.
patent: 4804828 (1989-02-01), Oogita
patent: 4961105 (1990-10-01), Yamamoto
patent: 4990759 (1991-02-01), Gloton et al.
patent: 5013900 (1991-05-01), Hoppe
patent: 5027190 (1991-06-01), Haghiri-Tehrani et al.
patent: 5031026 (1991-07-01), Ueda
patent: 5055913 (1991-10-01), Haghiri-Tehrani
patent: 5057679 (1991-10-01), Audic et al.
patent: 5208450 (1993-05-01), Uenishi et al.
patent: 5264990 (1993-11-01), Venambre
patent: 5283423 (1994-02-01), Venambre et al.
patent: 5438750 (1995-08-01), Venambre
patent: 5519201 (1996-05-01), Templeton, Jr. et al.
patent: 5598032 (1997-01-01), Fidalgo
patent: 5612532 (1997-03-01), Iwasaki
patent: 5637858 (1997-06-01), Hoppe et al.
patent: 5682294 (1997-10-01), Horejs, Jr. et al.
Fukushima Yoshikazu
Gogami Masao
Dai Nippon Printing Co. Ltd.
Lee Michael G.
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