Apparatus and method of manufacturing an integrated circuit (IC)

Details Apparatus and method of manufacturing an integrated circuit (IC) Apparatus and method of manufacturing an integrated circuit (IC)

1999-08-20

2000-06-20

Lee, Michael G

Registers

Records

Conductive

235488, 361737, G06K 1906

Patent

active

060767375

ABSTRACT:
An IC card (1) has a base card (2), and an IC module (10) placed in a cavity (3) formed in one surface of the base card (2). The IC module (10) comprises a substrate (11), a contact layer (15) formed on one surface of the substrate (11), an IC chip (12) attached to the other surface of the substrate (11), and a frame (14) attached to the other surface of the substrate (11). A space defined by the frame (14) is filled up with an encapsulating resin (13) so as to encapsulate the IC chip (12). A deflection per unit length of the substrate (11) under a predetermined load is greater than that of the base card (2) under the same load. When a bending force is applied to the IC card (1), a portion around the IC chip (12) is protected by the encapsulating resin (13) and the frame (14), and portion of the substrate (11) other than the portion around the IC chip (12) is distorted greatly to absorb the bending force.

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