Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Patent
1997-03-12
1999-08-31
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With means for controlling lead tension
257666, 257677, 361813, H01L 23495, H05K 502
Patent
active
059457325
ABSTRACT:
An integrated circuit package for improved warp resistance and heat dissipation is described. The LOC package includes: an integrated circuit die having an upper, active face, and a multi-layered, substantially planar lead frame mounted to the active face of the die, where the lead frame is preferably comprised of layers configured as Cu/INVAR/Cu or Cu/Alloy 42/Cu. The choice of the middle layer of the lead frame is selected to minimize the warping forces on the package such that the coefficient of thermal expansion of the composite lead frame approximates that of silicon. The copper layers of the lead frame provide improved heat dissipation.
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Clark Jhihan B.
Saadat Mahshid
Staktek Corporation
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