Apparatus and method of lapping works

Details Apparatus and method of lapping works Apparatus and method of lapping works

1997-03-21

1998-09-01

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 57, 451 60, 451285, 451286, 451287, 451288, 451289, 451446, B24B 500

Patent

active

058002510

ABSTRACT:
A lapping apparatus and a method for effectively utilizing a regenerated abrasive fluid in the lapping process of works such as semiconductor wafers or quartz wafers without causing any damage such as scratches to the works.
A work lapping method using a regenerated abrasive fluid prepared from a used abrasive fluid and a new abrasive fluid, which comprises the steps of preliminarily lapping a work using the regenerated abrasive fluid to a predetermined stock removal of the work, and finally lapping the preliminarily lapped work using the new abrasive fluid.

REFERENCES:
patent: 2780038 (1957-02-01), Laverdisse
patent: 5490809 (1996-02-01), Jones et al.
patent: 5575705 (1996-11-01), Yam et al.
patent: 5664990 (1997-09-01), Adams et al.
patent: 5676587 (1997-10-01), Landers et al.
Patent Abstracts of Japan, vol. 17, No. 139 (M-1385), Mar. 22, 1993 & JP 04 315576A (Japan Small Corp.), Nov. 6, 1992.
Patent Abstracts of Japan , vol. 10, No. 365 (M-542), Dec. 6, 1986 & JP 61 159368 A (Naoetsu Denshi Kogyo KK, Others: 01), Jul. 19, 1986.
Patent Abstracts of Japan, vol. 15, No. 003 (E-1019), Jan. 7, 1991 & JP 02 257627 A (Kyushu Electron Metal Co., Ltd., Others: 01), Oct. 18, 1990.
Patent Abstracts of Japan, vol. 95, No. 10, Nov. 30, 1995 & JP 07 186041 A (Murata Kogyo KK), Jul. 25, 1995.

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