Apparatus and method of inspecting the surface of a wafer

Details Apparatus and method of inspecting the surface of a wafer Apparatus and method of inspecting the surface of a wafer

2006-08-09

2009-06-09

Toatley, Jr., Gregory J (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

Reexamination Certificate

active

07545489

ABSTRACT:
An apparatus for inspecting a surface of a wafer includes an illumination device for illuminating an imaging area of the wafer with at least one broad-band spectrum, and an optical imaging device with a detector for polychromatic imaging of the imaging area of the wafer based on the illumination, wherein the imaging device includes a filter arrangement for selecting a plurality of narrow-band spectra. In addition, a method for inspecting the surface of a wafer, includes the steps of leveling a plurality of narrow-band spectra to a common intensity range, illuminating an imaging area of the wafer with at least one broad-band spectrum, and imaging a plurality of narrow-band spectra from the imaging area based on the illumination.

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