Apparatus and method of electrolytic removal of metals from...

Details Apparatus and method of electrolytic removal of metals from... Apparatus and method of electrolytic removal of metals from...

2011-08-09

2011-08-09

Van, Luan V (Department: 1724)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S280000

Reexamination Certificate

active

07993498

ABSTRACT:
An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.

REFERENCES:
patent: 6811680 (2004-11-01), Chen et al.
patent: 7638030 (2009-12-01), Nabeya et al.
patent: 2003/0213703 (2003-11-01), Wang et al.
patent: 2004/0053560 (2004-03-01), Sun et al.
patent: 2004/0154931 (2004-08-01), Hongo et al.
patent: 2004/0214510 (2004-10-01), So
patent: 2005/0124262 (2005-06-01), Manens
patent: 2006/0124474 (2006-06-01), Tsai et al.
patent: 2006/0229007 (2006-10-01), Mavliev et al.
Integrated Electro-Chemical Planarization (Ecmp) for Future Generation Device Technology, L. Economikos et al. (Date Unknown).

Affiliated with

Also associated with

Rating

Apparatus and method of electrolytic removal of metals from... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method of electrolytic removal of metals from..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method of electrolytic removal of metals from... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2685178