Apparatus and method of bonding isolation grooves of a ridge wav

Details Apparatus and method of bonding isolation grooves of a ridge wav Apparatus and method of bonding isolation grooves of a ridge wav

1994-01-28

1995-02-14

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228219, B23K 1008

Patent

active

053887557

ABSTRACT:
A novel method and apparatus improves the physical and electrical soldering bond between two electronic components by fluctuating the pressure of a non-oxidizing gas in a chamber which houses the two electronic components throughout a period when the solder has been made molten. This results in the solder effectively filling all crevices and grooves present on the surfaces being soldered. The method is particularly advantageous for soldering a ridge wave-guide laser diode P-side down to a heat sink to improve power capability, longevity and performance of the laser diode.

REFERENCES:
patent: 3632008 (1972-01-01), Lind
patent: 4645116 (1987-02-01), Henein et al.
patent: 4836434 (1989-06-01), Takenaka et al.
patent: 4974769 (1990-12-01), Mizuishi
patent: 5141147 (1992-08-01), Yokota

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