Apparatus and method of automatically removing a wafer carrier f

Metal working – Method of mechanical manufacture – Disassembling

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

414940, 414814, B23P 1900

Patent

active

059834790

ABSTRACT:
First and second pairs of jaws are located above the second pair by a predetermined amount. The first pair of jaws is arranged to grasp the lid of a container while the second pair of jaws is arranged to grasp a carrier disposed in the container. A vertically extending column is adapted to be moved laterally along a predetermined path and for supporting the first and second pairs of jaws. A jaw vertically moving controller is provided so as to lift and lower the first and second pairs of jaws along the column. On the other hand, a jaw controller is provided so as to selectively and respectively open and close the first and second pairs of jaws.

REFERENCES:
patent: 3938846 (1976-02-01), Yuryan
patent: 5028195 (1991-07-01), Ishii et al.
patent: 5123804 (1992-06-01), Ishii et al.
patent: 5460478 (1995-10-01), Akimoto et al.
patent: 5498118 (1996-03-01), Nakahara
patent: 5628604 (1997-05-01), Murata et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method of automatically removing a wafer carrier f does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method of automatically removing a wafer carrier f, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method of automatically removing a wafer carrier f will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1308781

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.