Apparatus and method of attaching an electronic device package a

Details Apparatus and method of attaching an electronic device package a Apparatus and method of attaching an electronic device package a

1989-08-18

1990-10-02

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, 165 803, 174 163, H05K 720

Patent

active

049611259

ABSTRACT:
Disclosed are apparatus and methods for attaching an electronic device package and a heat sink to a circuit board or the like. The electronic device package has a body with a planar bottom and leads extending from the body. The distal ends of the leads are coplanar with the bottom of the electronic device package. The heat sink has a base, heat-dissipating fins or the like and a clip for securing the electronic device package to the heat sink. A pair of dimples project downward from the base of the heat sink to tilt the bottom of the electronic device package. Tilting the electronic device package causes the ends of the leads to contact the circuit board so that the leads can be easily soldered to the circuit board. The dimples and the front edge of the heat sink can also be soldered to the circuit board.

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patent: 4609040 (1986-09-01), Moore
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patent: 4729426 (1988-03-01), Hinshaw
patent: 4755146 (1988-07-01), Rishworth et al.

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