Apparatus and method of application and development

Details Apparatus and method of application and development Apparatus and method of application and development

2006-03-21

2010-11-30

Tugbang, A. Dexter (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S745000, C118S066000

Reexamination Certificate

active

07841072

ABSTRACT:
Disclosed herein is a development apparatus having a plurality of coating units and a development process unit stacked on each other in a layered direction in a process block which is connected at the rear side of the carrier block. A first transportation unit, which ascends and descends in the layered direction, is provided in the carrier block. Also, in the carrier block, the bottom of a substrate inspection unit is located above a highest position to which the first transportation unit is able to ascend in the layered direction.

REFERENCES:
patent: 5943880 (1999-08-01), Tateyama
patent: 6261007 (2001-07-01), Takamori et al.
patent: 6264381 (2001-07-01), Ueda
patent: 6341903 (2002-01-01), Ueda
patent: 6402400 (2002-06-01), Ueda et al.
patent: 6471422 (2002-10-01), Ueda et al.
patent: 6585430 (2003-07-01), Matsuyama et al.
patent: 2006/0183340 (2006-08-01), Hayashida et al.
patent: 2007/0004052 (2007-01-01), Wada et al.
patent: 01-241840 (1989-09-01), None
patent: 7-288225 (1995-10-01), None
patent: 11-186358 (1999-07-01), None
patent: 2002-033266 (2002-01-01), None
patent: H02-033266 (2002-01-01), None
patent: 2004-311714 (2004-11-01), None
Japanese Office Action issued on Jul. 14, 2009 for Japanese Patent Application No. 2005-084546 with English translation.

Affiliated with

Also associated with

Rating

Apparatus and method of application and development does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method of application and development, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method of application and development will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4200305