Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-03-26
2009-08-04
Quach, Tuan N. (Department: 2893)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S125000, C257SE21499, C257SE23098
Reexamination Certificate
active
07569426
ABSTRACT:
A die package and a method and apparatus for integrating an electro-osmotic pump and a microchannel cooling assembly into a die package.
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List R. Scott
Myers Alan M.
Vandentop Gilroy J.
Intel Corporation
Quach Tuan N.
Schwegman Lundberg & Woessner, P.A.
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